Integrated Service Technology Inc. provides various verification services to the IC engineering industry in Taiwan and internationally. The company offers mass production services consisting of MOSFET wafer backend processes offers MOSFET front-side metallization, such as chemical/electro-less plating and front-side metal sputtering deposition; MOSFET backside grinding processes, including wafer thinning/non-taiko grinding/conventional grinding; MOSFET backside metallization processes comprising metal evaporation deposition and thick Ag process; and turnkey solutions for backend processes, which include chip probing, laser marking, vacuum mounting, ring removal, die sawing, frame probing, tape and reel, and final test. It provides verification analysis services, such as focused ion beam (FIB) circuit edit; engineering sample preparation services, including grinding, wafer dicing saw, die bonding, IC wire bonding/assembly solutions, and surface mount technique process; failure analysis offers electrical characteristics measurement, non-destructive analysis, defect detection, and competitive analysis services; and connectivity signal integrity test, and design quality management. In addition, the company offers material analysis solutions comprising sample preparation, structure observation, surface analysis, and thermal and component analysis; reliability design test, such as component and board level reliability test, PCB design verification, automotive electronics test, surface mount technique, warpage verification, and other services; chemical and material analysis services, includes environmental regulation test, chemical substance management, verification of PCB/ PCBA chemicals, oil/ water/ soil/ gaseous pollutant, and micro pollution test/ analysis; and various consultancy services, includes quality assurance and function safety, ESG, and laboratory accreditation and green mark. The company was incorporated in 1994 and is based in Hsinchu City, Taiwan.